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10 IBM Breakthroughs in 10 Years
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IBM SiGe (Silcon Germanium)
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POWER5 – Power Timeline
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POWER5 – Power5 Chip Die
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IBM POWER6 Microprocessor, 300mm Wafer
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POWER6
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IBM POWER6
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IBM POWER6 microprocessors arrive
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Multichip Module, The heart of an IBM System p5 595
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IBM System p5 models 590 and 595 use dual stress microprocessor technology
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IBM System p5 models 590 and 595 use dual stress microprocessor technology
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IBM 300mm manufacturing facility at East Fishkill, NY
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"Top Fab 2005"
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IBM’s mask technology center in Burlington, Vermont,
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STMicroelectronics and IBM to Collaborate on Chip Technology
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IBM eDRAM test chip
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Two IBM Transistors
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Cross-section of 64-bit high-performance microprocessor chip
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IBM Airgap Microprocessor
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From Traditional Printing to High Resolution Nano Printing
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Cell Broadband Engine
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IBM / Sony / Toshiba jointly developed Cell DD2 die (chip)
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IBM EXTENDS MOORE’S LAW TO THE THIRD DIMENSION
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IBM Hydro Cluster Water Cooling Technology
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IBM and Georgia Tech Break Silicon Speed Record
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Carbon nanotube: Light emissions
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IBM Scientists Create Method to Measure the Performance of Carbon Nanotubes as Building Blocks for Ultra Tiny Computer Chips of the Future
