Checking wafers processing
A technician checks individual wafers
Intel technicians monitor the wafers' progress
application and removal of a light-sensitive polymer coating on silicon wafers
Intel Fab workers in the cleanroom
Intel Fab workers don Gore-Tex® semi-custom-fitted bunnysuits that must be worn in the Fab cleanroom.
An Intel technician holds a wafer for the camera.
An Intel technician holds a wafer for the camera. Each square on the wafer is called a "die" and each microprocessor will eventually become the "brain" of a PC system.
Intel technicians monitor wafers
Intel technicians monitor wafers in an automated wet etch tool. The process cleans the wafers of any excess process chemicals or contamination.
An Intel manufacturing technician
An Intel manufacturing technician uses a scanner to start the very first 45nm production lot of 300mm wafers inside of Fab 32, Intel's first high-volume 45nm chip factory in Chandler, Ariz.
Close up of the wafer as it spins during a testing procedure.
Intel® Core™2 Extreme quad-core processor illustration
Intel® Core™2 Extreme quad-core processor illustration with text
Intel® D915PBL Motherboard
Intel® D915PBL Motherboard
Intel® D915PBL Motherboard
Intel® D915PBL Motherboard
Tyan S7002 motherboard
Intel® Pentium® 4 Processor
Intel® Pentium® 4 Processor
Intel® Pentium® 4 Processor Die
Intel® Pentium® 4 Processor Die
Intel® Pentium® 4 Die on 0.13 Micron
Intel® Pentium® 4 Die on 0.13 Micron
Intel® Pentium® 4 Die on 0.18 Micron
Intel® Pentium® 4 Die on 0.18 Micron
Intel® Pentium® 4 Wafer on 0.13 Micron
Intel® Pentium® 4 Wafer on 0.13 Micron
Dunnington wafer shot
Intel® Atom™ processor wafer
Nehalem wafer shot
Intel Peryn Quadcore Processor
Transistor with Hafnium-based high-k metal gate silicon technology
Intel's 45nm processors are based on Intel's groundbreaking transistors with Hafnium-based high-k metal gate silicon technology, the biggest change to how transistors are made in 40 years
Processors on an Intel 45nm ''Penryn'' Wafer
Processors on an Intel 45nm Hafnium-based High-k Metal Gate ''Penryn'' Wafer photographed with a pin. Using an entirely new transistor formula, the processors incorporate 410 million transistors for each dual core chip, and 820 million for each quad core chip.
Intel 45nm processor die
Wafer containing Intel’s new Xeon 5500 series processors
Patrick Gelsinger, Intel senior vice president and general manager of the Digital Enterprise Group, holds up a wafer containing Intel’s new Xeon 5500 series processors, Monday, March 30, 2009, at Intel headquarters in Santa Clara, Calif. Designed for servers that power the Internet and enterprises, each processor features four cores and 731 million transistors. Shipping today, the processors range in price from $188 to $1600 in quantities of 1,000. (Photo for Intel by Court Mast, Mast Photography, Inc., San Francisco) (www.mastphotography.com)
The Next Generation:Tulsa silicon wafer
Intel's Pat Gelsinger, cq, Senior Vice President, General Manager, Digital Enterprise Group, shows attendees The Next Generation:Tulsa silicon wafer during the Digital Enterprise keynote at the Fall Intel Developer Forum held at Moscone West on Wednesday, August 24, 2005 in San Francisco, Calif. (Photo by Intel Press Relations)